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| Feature | Capability |
|---|---|
| Single and double sided SMT/PTH | Yes |
| Large parts on both sides, BGA on both sides | Yes |
| Min Chips size | 01005 |
| Min BGA pitch and ball counts | 0.2mm pitch, >1000 count |
| Min Leaded parts pitch | 0.2 mm |
| Max Parts size assembly | 2.2 in. x 2.2 in. x 0.6 in. |
| Wave soldering | Yes |
| Max PCB size | 14.5 in. x 19.5 in. |
| Min PCB Thickness | 0.02 |
| Inspection Methods | X-ray / Microscope / 100% AOI testing |
| Rework Station | BGA removal & replacement / SMT IR rework |








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